- planar metallization
- металізація плоскої поверхні
English-Ukrainian dictionary of microelectronics. 2013.
English-Ukrainian dictionary of microelectronics. 2013.
Planar process — The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which modern integrated circuits are… … Wikipedia
Power MOSFET — A Power MOSFET is a specific type of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) designed to handle large power. Compared to the other power semiconductor devices (IGBT, Thyristor...), its main advantages are high commutation speed … Wikipedia
Microstrip — Cross section of microstrip geometry. Conductor (A) is separated from ground plane (D) by dielectric substrate (C). Upper dielectric (B) is typically air. Microstrip is a type of electrical transmission line which can be fabricated using printed… … Wikipedia
nanotechnology — /nan euh tek nol euh jee, nay neuh /, n. any technology on the scale of nanometers. [1987] * * * Manipulation of atoms, molecules, and materials to form structures on the scale of nanometres (billionths of a metre). These nanostructures typically … Universalium
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Mercury probe — The Mercury Probe is an electrical probing device to make rapid, non destructive contact to a sample for electrical characterization. Its primary application is semiconductor measurements where time consuming metallizations or photolithographic… … Wikipedia